Solderless Breadboard MB118 10.2" x 9.4" 3,220 tie points, 4 Binding Posts, Steel Plate Backing 2% - 24 hrs after

2% - 24 hrs after power-on

It may be used in experiments on bridge measurement

Test Level: 0

Operating Temperature: 32 to 122℉ (0 to 50℃)

Solderless Breadboard MB118 10.2" x 9.4" 3,220 tie points, 4 Binding Posts, Steel Plate Backing 2% - 24 hrs afterSolderless breadboard ideal for testing, prototyping and experimentation Contact Points: 3,220. Terminal Strips: 4. Bus Strips: 7. Binding Posts: 4. Features a sturdy steel back plate Nickel plated clips Size: 10. 2" x 9. 4" This solderless breadboard is ideal for testing, prototyping and experimentation. Features a sturdy steel back plate. Nickel plated clips. Terminal Strips: 4 Bus Strips: 7 Binding Posts: 4 Contact Points: 3,220 Size: 10. 2" x 9. 4"