Tecbond 4602F Temperature Resistant Bulk Packaging Hot Melt Application|Packaging Heat Resistance: 120°F/49°C
Description
Heat Resistance: 120°F/49°C
Excellent for craft projects and specialty applications
Tecbond LM44 is a low melt glue stick formulation that is very effective for heat distortion when bonding sensitive substrates such as polystyrene
Watts Volts: 80 Watts
Tecbond 4602F Temperature Resistant Bulk Packaging Hot Melt Application|Packaging Heat Resistance: 120°F/49°CPower Adhesives Tec 4602F Hot Melt Adhesive Tecbond 4602F is an extremely versatile temperature resistant packaging adhesive. The Tec 4602F hot melt adhesive has the broadest spectrum of temperature performance out of the Power Adhesives formulas. This packaging is a high quality, low odor product with great heat stability. This hot melt is very clean running which will reduce filter and bozzle blockages in dispensing equipment. The Tec 4602F
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy
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