Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro Each adhesive has unique bond

Each adhesive has unique bond characteristics and open time

motorized glue gun allowing for a continuous flow of glue without the use of a compressor

Heat Resistance: 130°F/54°C

Data Sheets and Brochures Franklin Reactite 6010 Technical Data Sheet (TDS)

Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro Each adhesive has unique bondBostik Thermogrip H1714 Overview H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250F to 275F) while still providing fiber tearing bonds over a wide temperature range on a variety of substrates. Key Features Low application temperature Clean running Fiber tearing bonds on a variety of board stocks