Tecbond 7731F Bulk Packaging Hot Melt Nozzle Type|Single Orifice Difficult to bond packaging substrates

Difficult to bond packaging substrates

Compact & Lightweight: Weighs just 0

11 lbs of glue stick size 1/2" x 10" is approximately 198 glue sticks

Ad Tech 962 Safety Data Sheet (SDS)

Tecbond 7731F Bulk Packaging Hot Melt Nozzle Type|Single Orifice Difficult to bond packaging substratesPower Adhesives Tecbond 7731F Hot Melt Adhesive The Power Adhesives 7731F adhesive is a premier universal bulk carton closing hot melt. The Tecbond 7731F adhesive has a fast set speed and is ideal for a wide range of carton closing and case sealing applications. It also maintains good bond integrity at a fairly wide range of temperatures. This hot melt is also used in a number of microwave packaging products. Contact us for samples or skid pricing.